IRFI520NPBF Datasheet, PDF (1/9 Pages) International Rectifier – HEXFET® Power MOSFET

HEXFET^® Power MOSFET
l Advanced Process Technology
l Isolated Package
l High Voltage Isolation = 2.5KVRMS …
l Sink to Lead Creepage Dist. = 4.8mm
l Fully Avalanche Rated
l Lead-Free
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve the
lowest possible on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
device for use in a wide variety of applications.
The TO-220 Fullpak eliminates the need for additional
insulating hardware in commercial-industrial applications.
The moulding compound used provides a high isolation
capability and a low thermal resistance between the tab
and external heatsink. This isolation is equivalent to using
a 100 micron mica barrier with standard TO-220 product.
The Fullpak is mounted to a heatsink using a single clip or
by a single screw fixing.
Absolute Maximum Ratings
Parameter
I_D @ T_C = 25°C Continuous Drain Current, V_GS @ 10V
I_D @ T_C = 100°C
I_DM
P_D @T_C = 25°C
Continuous Drain Current, V_GS @ 10V
Pulsed Drain Current †
Power Dissipation
Linear Derating Factor
V_GS
Gate-to-Source Voltage
E_AS
Single Pulse Avalanche Energy ‚†
I_AR
Avalanche Current†
E_AR
dv/dt
Repetitive Avalanche Current
Peak Diode Recovery dv/dt Ġ
T_J
Operating Junction and
T_STG
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 screw.
Thermal Resistance
Parameter
R_θJC
R_θJA
Junction-to-Case
Junction-to-Ambient
PD - 95599
IRFI520NPbF
D
V_DSS = 100V
G
R_DS(on) = 0.20Ω
S
I_D = 7.6A
TO-220 FULLPAK
Max.
7.6
5.3
38
30
0.20
±20
91
5.7
3.0
5.0
-55 to + 175
300 (1.6mm from case)
10 lbf•in (1.1N•m)
Min.
––––
––––
Typ.
––––
––––
Max.
5.0
65
Units
A
W
W/°C
V
mJ
A
mJ
V/ns
°C
Units
°C/W
7/27/04