IRFHM9391PBF_15 Datasheet, PDF (1/9 Pages) International Rectifier – Compatible with Existing Surface Mount Techniques

V_DSS
R_DS(on) max
(@ V_GS = -10V)
(@ V_GS = -4.5V)
Qg _(typical)
I_D
(@T_A = 25°C)
-30
14.6
22.5
32
-11
V
m
nC
A
Applications
System/load switch,
Charge or discharge switch for battery protection
Features
Low Thermal Resistance to PCB (<3.8°C/W)
Low Profile (<1.05 mm)
Industry-Standard Pinout
Compatible with Existing Surface Mount Techniques
RoHS Compliant, Halogen-Free
MSL1,Consumer Qualification
IRFHM9391TRPbF
HEXFET^® Power MOSFET
D5
D6
D7
D8
4G
3S
2S
1S
PQFN 3.3 x 3.3 mm
Benefits
Enable better Thermal Dissipation
results in Increased Power Density
 Multi-Vendor Compatibility
Easier Manufacturing
Environmentally Friendlier
Increased Reliability
Base part number
IRFHM9391PbF
Package Type
PQFN 3.3mm x 3.3mm
Standard Pack
Form
Quantity
Tape and Reel
4000
Orderable Part Number
IRFHM9391TRPbF
Absolute Maximum Ratings
V_GS
I_D @ T_A = 25°C
I_D @ T_A= 70°C
I_DM
I_D @ T_C(Bottom) = 25°C
I_D @ T_C(Bottom) = 100°C
I_D @ T_C = 25°C
P_D @T_A = 25°C
P_D @T_C(Bottom) = 25°C
T_J
T_STG
Parameter
Gate-to-Source Voltage
Continuous Drain Current, V_GS @ 10V
Continuous Drain Current, V_GS @ 10V
Pulsed Drain Current
Continuous Drain Current, V_GS @ 10V
Continuous Drain Current, V_GS @ 10V
Continuous Drain Current, V_GS @ 10V
(Source Bonding Technology Limited)
Power Dissipation 
Power Dissipation 
Linear Derating Factor 
Operating Junction and
Storage Temperature Range
Notes  through  are on page 9
Max.
± 25
-11
-9.0
-90
-38
-24
-24
2.6
33
0.021
-55 to + 150
Units
V
A
W
W/°C
°C
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July 01, 2014