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IRFB4410ZPBF Datasheet, PDF (1/11 Pages) International Rectifier – HEXFET Power MOSFET
PD - 97278B
IRFB4410ZPbF
IRFS4410ZPbF
IRFSL4410ZPbF
HEXFET® Power MOSFET
Applications
l High Efficiency Synchronous Rectification in SMPS
l Uninterruptible Power Supply
l High Speed Power Switching
G
l Hard Switched and High Frequency Circuits
D VDSS
RDS(on) typ.
max.
ID (Silicon Limited)
S ID (Package Limited)
100V
7.2m:
9.0m:
97c
75A
Benefits
l Improved Gate, Avalanche and Dynamic dV/dt
Ruggedness
l Fully Characterized Capacitance and Avalanche
SOA
l Enhanced body diode dV/dt and dI/dt Capability
l Lead-Free
D
DS
G
TO-220AB
IRFB4410ZPbF
D
D
DS
G
D2Pak
IRFS4410ZPbF
DS
G
TO-262
IRFSL4410ZPbF
G
Gate
D
Drain
S
Source
Absolute Maximum Ratings
Symbol
Parameter
ID @ TC = 25°C
ID @ TC = 100°C
ID @ TC = 25°C
IDM
PD @TC = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Package Limited)
Pulsed Drain Current d
Maximum Power Dissipation
Linear Derating Factor
VGS
Gate-to-Source Voltage
dv/dt
TJ
TSTG
Peak Diode Recovery f
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
(1.6mm from case)
Mounting torque, 6-32 or M3 screw
Avalanche Characteristics
EAS (Thermally limited) Single Pulse Avalanche Energy e
IAR
Avalanche Current c
EAR
Repetitive Avalanche Energy g
Thermal Resistance
Symbol
Parameter
RθJC
Junction-to-Case k
RθCS
Case-to-Sink, Flat Greased Surface , TO-220
RθJA
Junction-to-Ambient, TO-220 k
RθJA
Junction-to-Ambient (PCB Mount) , D2Pak jk
www.irf.com
Max.
97c
69c
75
390
230
1.5
± 20
16
-55 to + 175
300
10lbxin (1.1Nxm)
242
See Fig. 14, 15, 22a, 22b,
Typ.
–––
0.50
–––
–––
Max.
0.65
–––
62
40
Units
A
W
W/°C
V
V/ns
°C
mJ
A
mJ
Units
°C/W
1
06/01/07