IRF7707 Datasheet, PDF (1/8 Pages) International Rectifier – Power MOSFET(Vdss=-20V)

l Ultra Low On-Resistance
l P-Channel MOSFET
l Very Small SOIC Package
l Low Profile (< 1.2mm)
l Available in Tape & Reel
V_DSS
-20V
PD -93996
IRF7707
HEXFET^® Power MOSFET
R_DS(on) max
22mΩ@V_GS = -4.5V
33mΩ@V_GS = -2.5V
I_D
-7.0A
-6.0A
Description
HEXFET^® Power MOSFETs from International Rectifier
utilize advanced processing techniques to achieve ex-
tremely low on-resistance per silicon area. This benefit,
combined with the ruggedized device design, that Inter-
national Rectifier is well known for, provides thedesigner
with an extremely efficient and reliable device for
battery and load management.
The TSSOP-8 package has 45% less footprint area than
the standard SO-8. This makes the TSSOP-8 an ideal
device for applications where printed circuit board space
is at a premium. The low profile (<1.2mm) allows it to fit
easily into extremely thin environments such as portable
electronics and PCMCIA cards.
1
2
3
G
4
1= D
2= S
3= S
4= G
Absolute Maximum Ratings
V_DS
I_D @ T_A = 25°C
I_D @ T_A = 70°C
I_DM
P_D @T_A = 25°C
P_D @T_A = 70°C
V_GS
T_J , T_STG
Parameter
Drain-Source Voltage
Continuous Drain Current, V_GS @ -4.5V
Continuous Drain Current, V_GS @ -4.5V
Pulsed Drain Current
Maximum Power Dissipationƒ
Maximum Power Dissipationƒ
Linear Derating Factor
Gate-to-Source Voltage
Junction and Storage Temperature Range
D
8
7
6
S
5
8= D
7= S
6= S
5= D
TSSOP-8
Max.
-20
-7.0
-5.7
-28
1.5
1.0
0.01
±12
-55 to +150
Units
V
A
W
W
W/°C
V
°C
Thermal Resistance
Parameter
R_θJA
Maximum Junction-to-Ambientƒ
www.irf.com
Max.
83
Units
°C/W
1
10/04/00