English
Language : 

IRF7421D1 Datasheet, PDF (1/8 Pages) International Rectifier – MOSFET & Schottky Diode
PD 9.1411
PRELIMINARY
IRF7421D1
l Co-packaged HEXFET® Power
MOSFET and Schottky Diode
l Ideal For Synchronous Regulator
Applications
l Generation V Technology
l SO-8 Footprint
FETKY T M
A
1
8
S
2
7
S
3
6
G
4
5
Description
To p V ie w
The FETKYTM family of co-packaged HEXFETs and
Schottky diodes offer the designer an innovative board
space saving solution for switching regulator applications.
Generation 5 HEXFETs utilize advanced processing
techniques to achieve extremely low on-resistance per silicon
area. Combining this technology with International Rectifier's
low forward drop Schottky rectifiers results in an extremely
efficient device suitable for use in a wide variety of portable
electronics applications.
MOSFET & Schottky Diode
AA
D
VDSS = 30V
D
D
RDS(on) = 0.035Ω
D
Schottky Vf = 0.42V
The SO-8 has been modified through a customized leadframe
for enhanced thermal characteristics. The SO-8 package is
designed for vapor phrase, infra red or wave soldering
techniques.
S O -8
Absolute Maximum Ratings
ID @ TA = 25°C
ID @ TA = 25°C
ID @ TA = 70°C
IDM
PD @TA = 25°C
PD @TA = 25°C
VGS
TJ, TSTG
Parameter
Continuous Drain Current, VGS @ 10V**
Continuous Drain Current, VGS @ 10V*
Continuous Drain Current, VGS @ 10V*
Pulsed Drain Current 
Power Dissipation (PCB Mount)**
Power Dissipation (PCB Mount)*
Linear Derating Factor (PCB Mount)*
Gate-to-Source Voltage
Junction and Storage Temperature Range
Max.
6.4
4.1
3.3
33
2.5
1.0
8.0
± 20
-55 to + 150
Units
A
W
W
mW/°C
V
°C
Thermal Resistance
Parameter
Typ.
Max.
Units
RθJA
Junction-to-Amb. (PCB Mount, steady state)*
100
RθJA
Junction-to-Amb. (PCB Mount, steady state)**
40
RθJA
Junction-to-Amb. _Schottky *
100
125
50
°C/W
125
Notes:
 Repetitive rating – pulse width limited by max. junction temperature (see fig. 11)
‚ ISD ≤ 4.1A, di/dt ≤ 110A/µs, VDD ≤ V(BR)DSS, TJ ≤ 150°C
ƒ Pulse width ≤ 300µs – duty cycle ≤ 2%
* When mounted on FR-4 board using minimum recommended footprint.
** When mounted on 1 inch square copper board, for comparison with other SMD devices.
HEXFET is the registered trademark for International Rectifier Power MOSFETs )