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IRF7353D2 Datasheet, PDF (1/8 Pages) International Rectifier – FETKY MOSFET / Schottky Diode | |||
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PD- 93809
IRF7353D2
FETKY⢠MOSFET / Schottky Diode
q Co-Pack HEXFET® Power MOSFET and
Schottky Diode
A
q Ideal For Buck Regulator Applications A
q N-Channel HEXFET power MOSFET
q Low VF Schottky Rectifier
S
q Generation 5 Technology
G
q SO-8 Footprint
1
8
2
7
3
6
4
5
Top View
K
VDSS = 30V
K
D RDS(on) = 0.029â¦
D Schottky VF = 0.52V
Description
The FETKY⢠family of Co-Pack HEXFET® Power MOSFETs and Schottky
diodes offers the designer an innovative, board space saving solution for
switching regulator and power management applications. Generation 5
HEXFET power MOSFETs utilize advanced processing techniques to
achieve extremely low on-resistance per silicon area. Combinining this
technology with International Rectifier's low forward drop Schottky rectifiers
results in an extremely efficient device suitable for use in a wide variety of
portable electronics applications.
The SO-8 has been modified through a customized leadframe for enhanced
thermal characteristics. The SO-8 package is designed for vapor phase,
infrared or wave soldering techniques.
SO-8
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Parameter
Maximum
ID @ TA = 25°C
Continuous Drain Current Â
6.5
ID @ TA = 70°C
5.2
IDM
Pulsed Drain Current Â
52
PD @TA = 25°C
Power Dissipation Â
2.0
PD @TA = 70°C
1.3
Linear Derating Factor
16
VGS
dv/dt
Gate-to-Source Voltage
Peak Diode Recovery dv/dt Â
± 20
-5.0
TJ, TSTG
Junction and Storage Temperature Range
-55 to +150
Units
A
W
mW/°C
V
V/ns
°C
Thermal Resistance Ratings
Parameter
RθJA
Junction-to-Ambient Â
Maximum
62.5
Notes:
 Repetitive rating; pulse width limited by maximum junction temperature (see figure 9)
 Starting TJ = 25°C, L = 10mH, RG = 25â¦, IAS = 4.0A
 ISD ⤠4.0A, di/dt ⤠74A/µs, VDD ⤠V(BR)DSS, TJ ⤠150°C
 Pulse width ⤠300µs; duty cycle ⤠2%
Â
Surface mounted on FR-4 board, t ⤠10sec.
www.irf.com
7353d2.p65
1
11/8/99, 3:01 PM
Units
°C/W
1
11/8/99
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