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IRF7353D1 Datasheet, PDF (1/8 Pages) International Rectifier – FETKY MOSFET / Schottky Diode | |||
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PD- 91802A
IRF7353D1
FETKY⢠MOSFET / Schottky Diode
q Co-packaged HEXFET® Power MOSFET
and Schottky Diode
A
1
8
K
q Ideal For Buck Regulator Applications
q N-Channel HEXFET
q Low VF Schottky Rectifier
q Generation 5 Technology
A
2
S
3
G
4
7
K
6
D
5
D
q SO-8 Footprint
Description
Top View
The FETKY family of co-packaged MOSFETs and Schottky diodes offers the
designer an innovative, board space saving solution for switching regulator
and power management applications. Generation 5 HEXFET Power
MOSFETs utilize advanced processing techniques to achieve extremely low
on-resistance per silicon area. Combinining this technology with
International Rectifier's low forward drop Schottky rectifiers results in an
extremely efficient device suitable for use in a wide variety of portable
electronics applications.
The SO-8 has been modified through a customized leadframe for
enhanced thermal characteristics. The SO-8 package is designed for vapor
phase, infrared or wave soldering techniques.
VDSS = 30V
RDS(on) = 0.029â¦
Schottky Vf = 0.39V
S O -8
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Parameter
Maximum
ID @ TA = 25°C
Continuous Drain Current Â
6.5
ID @ TA = 70°C
5.2
IDM
Pulsed Drain Current Â
52
PD @TA = 25°C
Power Dissipation Â
2.0
PD @TA = 70°C
1.3
Linear Derating Factor
16
VGS
dv/dt
Gate-to-Source Voltage
Peak Diode Recovery dv/dt Â
± 20
-5.0
TJ, TSTG
Junction and Storage Temperature Range
-55 to +150
Thermal Resistance Ratings
Parameter
RθJA
Junction-to-Ambient Â
Maximum
62.5
Notes:
 Repetitive rating; pulse width limited by maximum junction temperature (see figure 9)
 Starting TJ = 25°C, L = 10mH, RG = 25â¦, IAS = 4.0A
 ISD ⤠4.0A, di/dt ⤠74A/µs, VDD ⤠V(BR)DSS, TJ ⤠150°C
 Pulse width ⤠300µs; duty cycle ⤠2%
Â
Surface mounted on FR-4 board, t ⤠10sec.
www.irf.com
Units
A
W
mW/°C
V
V/ns
°C
Units
°C/W
1
3/17/99
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