IRF7328 Datasheet, PDF (1/8 Pages) International Rectifier – HEXFET Power MOSFET

q Trench Technology
q Ultra Low On-Resistance
q Dual P-Channel MOSFET
q Available in Tape & Reel
V_DSS
-30V
PD -94000
IRF7328
HEXFET^® Power MOSFET
R_DS(on) max
21mΩ@V_GS = -10V
32mΩ@V_GS = -4.5V
I_D
-8.0A
-6.8A
Description
New trench HEXFET^® Power MOSFETs from
International Rectifier utilize advanced processing
techniques to achieve extremely low on-resistance
per silicon area. This benefit, combined with the
ruggedized device design that HEXFET power
MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use
in battery and load management applications.
S1
1
G1
2
S2
3
G2
4
8
D1
7
D1
6
D2
5
D2
To p V iew
SO-8
Absolute Maximum Ratings
Parameter
V_DS
I_D @ T_A = 25°C
I_D @ T_A = 70°C
I_DM
P_D @T_A = 25°C
P_D @T_A = 70°C
Drain-Source Voltage
Continuous Drain Current, V_GS @ -10V
Continuous Drain Current, V_GS @ -10V
Pulsed Drain Current
Maximum Power Dissipationƒ
Maximum Power Dissipationƒ
Linear Derating Factor
V_GS
T_J , T_STG
Gate-to-Source Voltage
Junction and Storage Temperature Range
Thermal Resistance
Parameter
R_θJA
Maximum Junction-to-Ambient ƒ
www.irf.com
Max.
-30
-8.0
-6.4
-32
2.0
1.3
16
± 20
-55 to + 150
Units
V
A
W
W
mW/°C
V
°C
Max.
62.5
Units
°C/W
1
10/04/00