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IRF7322D1PBF Datasheet, PDF (1/8 Pages) International Rectifier – FETKY MOSFET / Schottky Diode
PD - 95298
IRF7322D1PbF
FETKYä MOSFET / Schottky Diode
l Co-packaged HEXFET® Power MOSFET
and Schottky Diode
A
l Ideal For Buck Regulator Applications
A
l P-Channel HEXFET
l Low VF Schottky Rectifier
S
l Generation 5 Technology
G
l SO-8 Footprint
l Lead-Free
1
8
K
VDSS = -20V
2
7
K
3
6
D
RDS(on) = 0.058Ω
4
5 D Schottky Vf = 0.39V
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Description
The FETKY family of co-packaged MOSFETs and Schottky diodes offers the
designer an innovative, board space saving solution for switching regulator
and power management applications. Generation 5 HEXFET Power
MOSFETs utilize advanced processing techniques to achieve extremely low
on-resistance per silicon area. Combinining this technology with
International Rectifier's low forward drop Schottky rectifiers results in an
extremely efficient device suitable for use in a wide variety of portable
electronics applications.
SO-8
The SO-8 has been modified through a customized leadframe for
enhanced thermal characteristics. The SO-8 package is designed for vapor
phase, infrared or wave soldering techniques.
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Parameter
Maximum
ID @ TA = 25°C
ID @ TA = 70°C
IDM
PD @TA = 25°C
PD @TA = 70°C
VGS
dv/dt
TJ, TSTG
Continuous Drain Current, VGS @ -4.5V
Pulsed Drain Current À
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt Á
Junction and Storage Temperature Range
-5.3
-4.3
-43
2.0
1.3
16
± 12
-5.0
-55 to +150
Thermal Resistance Ratings
Units
A
W
mW/°C
V
V/ns
°C
Parameter
RθJA
Junction-to-Ambient Ã
Maximum
62.5
Units
°C/W
Notes:
À Repetitive rating; pulse width limited by maximum junction temperature (see figure 9)
Á ISD ≤ -2.9A, di/dt ≤ -77A/µs, VDD ≤ V(BR)DSS, TJ ≤ 150°C
 Pulse width ≤ 300µs; duty cycle ≤ 2%
à Surface mounted on FR-4 board, t ≤ 10sec.
www.irf.com
1
10/12/04