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IRF7316QPBF Datasheet, PDF (1/7 Pages) International Rectifier – HEXFET Power MOSFET
PD - 96126
l Advanced Process Technology
l Ultra Low On-Resistance
l Dual P- Channel MOSFET
l Surface Mount
l Available in Tape & Reel
l 150°C Operating Temperature
l Automotive [Q101] Qualified
l Lead-Free
Description
Specifically designed for Automotive applications, these
HEXFET® Power MOSFET's in a Dual SO-8 package utilize
the lastest processing techniques to achieve extremely low
on-resistance per silicon area. Additional features of these
Automotive qualified HEXFET Power MOSFET's are a
150°C junction operating temperature, fast switching
speed and improved repetitive avalanche rating. These
benefits combine to make this design an extremely efficient
and reliable device for use in Automotive applications and
a wide variety of other applications.
The efficient SO-8 package provides enhanced thermal
characteristics and dual MOSFET die capability making it
ideal in a variety of power applications. This dual, surface
mount SO-8 can dramatically reduce board space and is
also available in Tape & Reel.
IRF7316QPbF
HEXFET® Power MOSFET
S1
1
G1
2
S2
3
G2
4
8
D1
7
D1
VDSS = -30V
6
D2
5 D2 RDS(on) = 0.058Ω
Top View
SO-8
Absolute Maximum Ratings ( TA = 25°C Unless Otherwise Noted)
Symbol
Maximum
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
Continuous Drain Current…
TA = 25°C
TA = 70°C
ID
Pulsed Drain Current
IDM
Continuous Source Current (Diode Conduction)
IS
Maximum Power Dissipation …
TA = 25°C
TA = 70°C
PD
Single Pulse Avalanche Energy
EAS
-30
± 20
-4.9
-3.9
-30
-2.5
2.0
1.3
140
Avalanche Current
IAR
-2.8
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt ƒ
EAR
dv/dt
0.20
-5.0
Junction and Storage Temperature Range
TJ, TSTG
-55 to + 150
Units
V
A
W
mJ
A
mJ
V/ ns
°C
Thermal Resistance Ratings
Parameter
Maximum Junction-to-Ambient…
www.irf.com
Symbol
RθJA
Limit
62.5
Units
°C/W
1
08/29/07