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IRF1405PBF Datasheet, PDF (1/9 Pages) International Rectifier – AUTOMOTIVE MOSFET | |||
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PD - 94969
AUTOMOTIVE MOSFET IRF1405PbF
Typical Applications
â Electric Power Steering (EPS)
â Anti-lock Braking System (ABS)
â Wiper Control
â Climate Control
â Power Door
â Lead-Free
Benefits
â Advanced Process Technology
G
â Ultra Low On-Resistance
â Dynamic dv/dt Rating
â 175°C Operating Temperature
â Fast Switching
â Repetitive Avalanche Allowed up to Tjmax
Description
Specifically designed for Automotive applications, this
Stripe Planar design of HEXFET® Power MOSFETs
utilizes the latest processing techniques to achieve
extremely low on-resistance per silicon area. Additional
features of this HEXFET power MOSFET are a 175°C
junction operating temperature, fast switching speed
and improved repetitive avalanche rating. These benefits
combine to make this design an extremely efficient and
reliable device for use in Automotive applications and a
wide variety of other applications.
Absolute Maximum Ratings
HEXFET® Power MOSFET
D
VDSS = 55V
RDS(on) = 5.3mâ¦
ID = 169AÂ
S
TO-220AB
Parameter
ID @ TC = 25°C
ID @ TC = 100°C
IDM
PD @TC = 25°C
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current Â
Power Dissipation
Linear Derating Factor
VGS
EAS
IAR
EAR
dv/dt
Gate-to-Source Voltage
Single Pulse Avalanche EnergyÂ
Avalanche Current
Repetitive Avalanche EnergyÂ
Peak Diode Recovery dv/dt Â
TJ
TSTG
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or M3 screw
Thermal Resistance
Max.
169Â
118Â
680
330
2.2
± 20
560
See Fig.12a, 12b, 15, 16
5.0
-55 to + 175
300 (1.6mm from case )
10 lbfâ¢in (1.1Nâ¢m)
Units
A
W
W/°C
V
mJ
A
mJ
V/ns
°C
RθJC
RθCS
RθJA
www.irf.com
Parameter
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Typ.
âââ
0.50
âââ
Max.
0.45
âââ
62
Units
°C/W
1
02/02/04
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