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IR3103 Datasheet, PDF (1/11 Pages) International Rectifier – Half-Bridge FredFET and Integrated Driver
PD-96992 Rev.A
IR3103
Half-Bridge FredFET
Series
and Integrated Driver
0.75A, 500V
Description
The IR3103 is a gate driver IC integrated with a half bridge FredFET designed for motor drive applications
up to 180W (heatsink-less). The sleek and compact single-in-line package is optimized for electronic motor
control in appliance applications such as fans and compressors for refrigerators. The IR3103 offers an
extremely compact, high performance half-bridge inverter in a single isolated package for two-phase and
three-phase motor drivers.
Proprietary HVIC and latch immune CMOS technologies, along with the HEXFET® power FredFET
technology (HEXFET® MOSFET with ultra-fast recovery body diode characteristics), enable efficient and
rugged single package construction. Propagation delays for the high and low side power FredFETs are
matched thanks to advanced IC technology.
Features
• Output Power FredFET in Half-Bridge Configuration
• High Side Gate Drive Designed for Bootstrap Operation
• Bootstrap Diode Integrated into Package
• Lower Power Level-Shifting Circuit
• Lower di/dt Gate Drive for Better Noise Immunity
• Excellent Latch Immunity on All Inputs and Outputs
• ESD Protection on All Leads
• Isolation 1500 VRMS min.
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM. Power dissipation is measured under board mounted and still air
conditions.
Parameter
Description
Max. Value
Units
VDS
Drain to Source Blocking Voltage
500
V
VDD
DC Bus Supply Voltage (No Switching Operation)
500
V
IO (TA=25°C)
Continuous Output Current (1)
0.7
A
IO (TA=55°C)
Continuous Output Current (1)
0.6
A
IO (TA=25°C)
Pulsed Output Current (2)
2.7
A
Pd
Package Power Dissipation @TA ≤ 55°C (3)
1.4
W
VISO
Isolation Voltage (1min)
1500
VRMS
TJ
Junction Temperature (Power MOSFET)
-40 to +150
°C
TS
Storage Temperature
-40 to +150
°C
TL
Lead Temperature (soldering, 10 seconds)
300
°C
TS
Storage Temperature
-40 to +150
°C
Note 1: See figure 3, fPWM=16kHz
Note 2: TP=100ms, other conditions as per Figure 3, fPWM=16kHz
Note 3: Single Device Operating
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