IR130CSP Datasheet, PDF (1/5 Pages) International Rectifier – Flipky

Flipky^TM
Features
z Ultra Low V_F per Footprint Area
z Low Thermal Resistance
z One-fifth Footprint of SMA
z Super Low Profile (<.8mm)
z Available Tested on Tape & Reel
Bulletin I0182J 08/05
IR130CSP
1 Amp
Flipky^TM
Major Ratings and Characteristics
Characteristics
IR130CPS Units
I_F(AV) Rectangular waveform
1.0
A
V_RRM
30
V
I_FSM @ tp = 5 µs sine
220
A
V_F @ 1.0 Apk, T_J=125°C
0.33
V
T_J range
- 55 to 150
°C
Description
True chip-scale packaging is available from International
Rectifier. The IR130CPS surface-mount Schottky recti-
fier has been designed for applications requiring low
forward drop and very small foot prints on PC boards.
Typical applications are in disk drives, switching power
supplies, converters, free-wheeling diodes, battery
charging, and reverse battery protection.
z Small foot print, surface mountable
z Low forward voltage drop
z High frequency operation
z Guard ring for enhanced ruggedness and long term
reliability
The Flipky^TM package, is one-fifth the footprint of a
comparable SMA package and has a profile of less then
.8mm. Combined with the low thermal resistance of the
die level device, this makes the Flipky^TM the best device
for application where printed circuit board space is at a
premium and in extremely thin application environments
such as battery packs, cell phones and PCMCIA cards.
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