HFA60MB60C Datasheet, PDF (1/5 Pages) International Rectifier – Ultrafast, Soft Recovery Diode

HEXFRED^TM
Features
• Reduced RFI and EMI
• Reduced Snubbing
• Extensive Characterization of
Recovery Parameters
PD -2.462 rev. A 03/99
HFA60MB60C
Ultrafast, Soft Recovery Diode
(ISOLATED BASE)
(1-3) (4-6) (7-9)
ANODE COMMON ANODE
1 CATHODE
2
V_R = 600V
V_F(typ.)ƒ = 1.1V
I_F(AV) = 60A
Q_rr (typ.) = 200nC
I_RRM(typ.) = 6A
t_rr(typ.) = 30ns
di_(rec)M/dt (typ.)ƒ = 170A/µs
Description
HEXFRED^TM diodes are optimized to reduce losses and EMI/RFI in high frequency
power conditioning systems. An extensive characterization of the recovery
behavior for different values of current, temperature and di/dt simplifies the
calculations of losses in the operating conditions. The softness of the recovery
eliminates the need for a snubber in most applications. These devices are
ideally suited for power converters, motors drives and other applications where
switching losses are significant portion of the total losses.
Absolute Maximum Ratings (per Leg)
D-60
A
(MODIFIED T0-249AA)
V_R
IF @ TC = 25°C
IF @ TC = 100°C
IFSM
E_AS
PD @ TC = 25°C
PD @ TC = 100°C
TJ
T_STG
Parameter
Cathode-to-Anode Voltage
Continuous Forward Current
Continuous Forward Current
Single Pulse Forward Current 
Non-Repetitive Avalanche Energy ‚
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 sec.
Max.
600
50
24
200
220
125
50
-55 to +150
300 (0.063 in. (1.6mm) from case)
Units
V
A
µJ
W
°C
Thermal - Mechanical Characteristics
RθJC
RθCS
Wt
Parameter
Junction-to-Case, Single Leg Conducting
Junction-to-Case, Both Legs Conducting
Case-to-Sink, Flat, Greased Surface
Weight
Mounting Torque
Note:  Limited by junction temperature
‚ L = 100µH, duty cycle limited by max TJ
ƒ 125°C
Min.
––––
––––
––––
––––
35 (4.0)
Typ.
––––
––––
0.10
58 (2.0)
––––
Max.
1.0
0.50
––––
––––
50 (5.7)
Units
°C/W
K/W
g (oz)
lbf•in
(N•m)
1