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AUIRLS3034-7P Datasheet, PDF (1/12 Pages) International Rectifier – HEXFETPower MOSFET | |||
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AUTOMOTIVE GRADE
PD - 97717A
Features
â Advanced Process Technology
â Ultra Low On-Resistance
â Dynamic dv/dt Rating
â 175°C Operating Temperature
â Fast Switching
â Repetitive Avalanche Allowed up to Tjmax
â Lead-Free, RoHS Compliant
â Automotive Qualified *
AUIRLS3034-7P
HEXFET® Power MOSFET
D VDSS
40V
RDS(on) typ.
1.0mï
max. 1.4mï
G
ID (Silicon Limited)
c 380A
S ID (Package Limited) 240A
Description
Specifically designed for Automotive applications, this HEXFET®
Power MOSFET utilizes the latest processing techniques to
achieve extremely low on-resistance per silicon area. Additional
features of this design are a 175°C junction operating
temperature, fast switching speed and improved repetitive
avalanche rating . These features combine to make this design
an extremely efficient and reliable device for use in Automotive
applications and a wide variety of other applications.
D
S
SS
S
S
G
D2Pak 7 Pin
AUIRLS3034-7P
G
Gate
D
Drain
S
Source
Absolute Maximum Ratings
Stresses beyond those listed under âAbsolute Maximum Ratingsâ may cause permanent damage to the device. These are stress ratings only; and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
Symbol
ID @ TC = 25°C
ID @ TC = 100°C
ID @ TC = 25°C
IDM
PD @TC = 25°C
Parameter
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
d Continuous Drain Current, VGS @ 10V (Wire Bond Limited)
Pulsed Drain Current
Maximum Power Dissipation
Max.
 380
 270
240
1540
380
Units
A
W
Linear Derating Factor
2.5
W/°C
VGS
EAS
IAR
EAR
dv/dt
Gate-to-Source Voltage
e Single Pulse Avalanche Energy (Thermally Limited)
Ãd Avalanche Current
d Repetitive Avalanche Energy
f Peak Diode Recovery
± 20
250
See Fig. 14, 15, 22a, 22b
1.3
V
mJ
A
mJ
V/ns
TJ
TSTG
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
-55 to + 175
°C
300
(1.6mm from case)
Thermal Resistance
Symbol
Rï±JC
Rï±JA
Parameter
kl Junction-to-Case
j Junction-to-Ambient
Typ.
âââ
âââ
Max.
0.40
40
Units
°C/W
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
11/29/11
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