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AUIRFS4310Z Datasheet, PDF (1/12 Pages) International Rectifier – HEXFETPower MOSFET | |||
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AUTOMOTIVE GRADE
PD - 97715A
Features
â Advanced Process Technology
â Ultra Low On-Resistance
â Dynamic dv/dt Rating
â 175°C Operating Temperature
â Fast Switching
G
â Repetitive Avalanche Allowed up to Tjmax
â Lead-Free, RoHS Compliant
â Automotive Qualified *
Description
Specifically designed for Automotive applications, this HEXFET®
Power MOSFET utilizes the latest processing techniques to
achieve extremely low on-resistance per silicon area. Additional
features of this design are a 175°C junction operating temperature,
fast switching speed and improved repetitive avalanche rating .
These features combine to make this design an extremely efficient
and reliable device for use in Automotive applications and a wide
variety of other applications.
AUIRFS4310Z
HEXFET® Power MOSFET
D VDSS
RDS(on) typ.
max.
100V
4.8m:
6.0m:
ID (Silicon Limited)
c 127A
S ID (Package Limited) 120A
D
G
Gate
DS
G
D2Pak
AUIRFS4310Z
D
Drain
S
Source
Absolute Maximum Ratings
Stresses beyond those listed under âAbsolute Maximum Ratingsâ may cause permanent damage to the device. These are stress ratings only; and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
Symbol
ID @ TC = 25°C
ID @ TC = 100°C
ID @ TC = 25°C
IDM
PD @TC = 25°C
Parameter
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Wire Bond Limited)
d Pulsed Drain Current
Maximum Power Dissipation
Max.
 127
90Â
120
560
250
Units
A
W
VGS
EAS
IAR
EAR
dv/dt
TJ
TSTG
Linear Derating Factor
Gate-to-Source Voltage
e Single Pulse Avalanche Energy (Thermally Limited)
Ãd Avalanche Current
d Repetitive Avalanche Energy
f Peak Diode Recovery
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
1.7
± 20
130
See Fig. 14, 15, 22a, 22b,
18
-55 to + 175
300
W/°C
V
mJ
A
mJ
V/ns
°C
(1.6mm from case)
Thermal Resistance
Symbol
Rï±JC
Rï±JA
Parameter
k Junction-to-Case
j Junction-to-Ambient (PCB Mount)
Typ.
âââ
âââ
Max.
0.6
40
Units
°C/W
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
10/10/11
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