WBDDSS4-A-01-1002-JG Datasheet, PDF (4/4 Pages) IRC - a TT electronics Company. – Wire Bondable Resistor Network Arrays

Wire Bondable
Resistor Network Arrays
Physical Data
DQSCX
0.115˝ ±0.001
(2.921mm ±0.025)
Pad 1
0.004˝ min Bond Pads
DQSCA
24
23
22
21
20
19
18
17
16
15
14
13
R1
1
2
3
4
5
6
7
8
9
10
11
12
DQSCB
24
23
22
21
20
19
18
17
16
15
14
13
R1
1
2
3
4
5
6
7
8
9
10
11
12
Environmental Data
Test
Method
Max ∆R Typical ∆R
Thermal Shock
High Temperature
Exposure
MIL-STD-202
Method 107
Test condition F
MIL-STD-883
Method 1008
150°C, 1000 hours
Low Temperature
Storage
-55°C, 1000 hours
Life
Life at Elevated
Temperature
MIL-STD-202
Method 108
70°C, 1000 hours
MIL-STD-202
Method 108
125°C, 1000 hours
±0.1%
±0.1%
±0.03%
±0.5%
±0.5%
±0.02%
±0.05%
±0.01%
±0.01%
±0.05%
Ordering Data
Prefix
WBD DSS8 - B - 01 - 1002 - F - B
Style
DSS4 = 8-pad Network
DSS8 = 6-pad Network
DQSC = 24-pad Network
Schematic and Termination
A = Isolated; B = Bussed
TCR/Inspection Code
Reference TCR/Inspection Code Table
Resistance Code
4-Digit Resistance Code
Ex: 1002 = 10KΩ, 50R1 = 50.1Ω
Absolute Tolerance Code
J = ±5%; G = ±2%; F = ±1%;
D = ±0.5%; C = ±0.25%; B = ±0.1%
Ratio Tolerance Code (optional)
G = ±2%; F = ±1%; D = ±0.5%;
C = ±0.25%; B = ±0.1%; A = 0.05%
Packaging
Standard packaging is 2˝ x 2˝ chip tray. For additional information
or to discuss your specific requirements, please contact our Applications
Team using the contact details below.
© IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: [phone] • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Series Issue January 2009 Sheet 4 of 4