OARS3R005FLF Datasheet, PDF (4/4 Pages) IRC - a TT electronics Company. – Open Air Sense Resistors Metal Alloy Strip

OARS-3
Open Air Sense Resistors
Metal Alloy Strip
IRC Solder Reflow Recommendations
T_P
T_L
T_smax
Sn-Pb Eutectic and Pb-Free Reflow Profiles
t_P
Ramp-up
t_L
Critical Zone
T_L to T_P
T_smin
t_s
Preheat
Ramp-down
25
t 25°C to Peak
Time
* Based on Industry Standards and IPC recommendations
Profile Feature
Average Ramp-up rate (Tsmax to Tp)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
Time maintained above
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Time within 5°C of actual Peak Temperature (tp)2
Ramp-down Rate
Time 25°C to Peak Temperature
Sn-Pb Eutectic
Assembly
3°C / second max.
100°C
150°C
60 -120 seconds
183°C
60 - 150 seconds
See Table 1
10 - 30 seconds
6°C / second max.
6 minutes max.
Pb-Free
Assembly
3°C / second max.
150°C
200°C
60 -180 seconds
217°C
60 - 150 seconds
See Table 2
20 - 40 seconds
6°C / second max.
8 minutes max.
Note 1: All temperatures refer
to topside of the package,
measured on the package
body surface.
Note 2: Time within 5 °C of
actual peak temperature (tp)
specified for the reflow profiles
is a “supplier” minimum and a
“user” maximum.
Tabel 1: SnPb Eutectic Process -
Package Peak Reflow Temperatures
Package
Thickness
Volume mm3 < 350 Volume mm3 ≥ 350
< 2.5 mm
240 +0/-5°C
225 +0/-5°C
≥ 2.5 mm
225 +0/-5°C
225 +0/-5°C
Tabel 2: Pb-free Process -
Package Peak Reflow Temperatures
Package
Volume mm3 Volume mm3 Volume mm3
Thickness
< 350
350 - 2000
> 2000
< 1.6 mm
260°C *
260°C *
260°C *
1.6 mm - 2.5 mm 260°C *
250°C *
245°C *
≥ 2.5 mm
250°C *
245°C *
245°C *
* Tolerance: The device manufacturer/supplier shall assure process compat-
ibility up to and including the stated classification temperature at the rated MSL
level.
Note 1: Package volume excludes external
terminals (balls, bumps, lands, leads) and/or
non-integral heat sinks.
Note 2: The maximum component temperature
reached during reflow depends on package
thickness and volume. The use of convection
reflow processess reduces the thermal gradients
between packages. However, thermal gradients
due to differences in thermal mass of SMD pack-
ages may still exist.
Note 3: Components intended for use in “lead-
free” assembly process shall be evaluated using
the “lead-free” peak temperature and profiles
defined in Table 1, 2 and reflow profile whether
or not lead-free.
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: [phone] • Facsimile: 361 992 3377 • Website: www.irctt.com
February 2009 Issue Page 4 of 4