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OARS-XPR005FLF Datasheet, PDF (2/3 Pages) IRC - a TT electronics Company. – Open Air Sense Resistors Metal Alloy Strip
OARS XP
Open Air Sense Resistors
Metal Alloy Strip
Physical Data
L
W
H
D
T
IRC
Type
OARS-XP
L (Resistance
Dependant)
0.425 - 0.470
(10.7 - 12.0)
Dimensions (Inches and (mm))
H (Resistance
Dependant)
T
0.090 - 0.180
(2.28 - 4.57)
0.093 ± 0.010
(2.36 ± 4.57)
D
0.190 ± 0.030
(4.83 ± 0.76)
W
0.250 ± 0.015
(6.35 ± 0.38)
Power Derating Curve
6.0
5.0
4.0
3.0
2.0
0.0
25
60
95
130
165
Ambient Temperature (°C)
195
225
Note:
The power derating curve is a guidance based on a conser-
vative design model. The OARS XP is a solid metal alloy
construction that can withstand significantly greater operating
temperatures than conservative design models permit. The
resistive alloys can withstand temperatures in exess of 350°C.
Therefore, the system thermal design is a more significant
design parameter due to the heat limitations of solder joints
and/or circuit board substrate materials. Refer to additional
information below.
The thermal image (not a simulation) to the left is of an OARS
XP 2.5 mΩ running at 5 Watts. Notice the hotpsot is nearly
205°C, but the solder joint is approximately 115°C (FR4 is
rated for 130°C). The unique construction of the OARS XP
isolates the hotspot from the circuit board material preventing
damage. Additionally, the thermal energy is dissipated to the
air instead of being conducted into the circuit board potentially
causing a nearby power component to exceed its rating.
OARS XP R0025 Thermal Image @ 5 Watts
Ambient conditions, No forced air.
The standard test circuit board consists of a four layer FR4
material with 2 ounce outer layers and 1 ounce inner layers,
which is typical of many industry designs. Contact IRC for
more details or for other thermal image test data for specific
resistance values and power levels.
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
OARS-XP Issue May 2009 Sheet 2 of 3