PPS11001000F Datasheet, PDF (1/2 Pages) IRC - a TT electronics Company. – Metal Glaze Power Pack Surface Mount High Power Density Ceramic Package

Metal Glaze^™ Power Pack
Surface Mount High Power
Density Ceramic Package
PPS-1 Series
• Low inductance
• 0.1Ω to 348KΩ range
• Superior surge handling capability
• 150°C maximum operating temperature
• 1 Watt performance - standard 2010 footprint
• Flameproof ceramic package provides superior temperature rise profile
Electrical Data
Size
IRC
Type
Maximum
Power Rating
Working Maximum Resistance Range
Voltage¹ Voltage
(ohms)
2010
PPS-1
1W
350
¹Not to exceed ( √ P x R )^½. ²Consult factory for tighter tolerances and TCRs.
700
0.1 to 0.99
1.0 to 348K
Tolerance
(±%)²
1, 2, 5
1, 2, 5
TCR
(ppm/°C)²
100
50, 100
Applications
The PPS-1 will dissipate 1 watt at 70°C on a 2010 footprint. The PPS-1 is recommended for applications where
board real estate or component/board TCE mismatch is a major concern. It is also recommended in circuits
where a standard 2010 resistor exhibits marginal or unacceptable performance due to high power density/surge
handling demands.
Environmental Data
Characteristic
Maximum Change
Test Method
Thermal Shock
±(0.5% + 0.01 ohm) MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
Low Temperature Operation
±(0.25% + 0.01 ohm) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
Short Time Overload
±(1.0% + 0.01 ohm) MIL-R-55342E Par 4.7.5 (2.5 x (PxR)^½
High Temperature Exposure
Resistance to Bonding Exposure
Solderability
±(0.5% + 0.01 ohm)
±(0.25% + 0.01 ohm)
95% minimum coverage
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7 (Reflow soldered to board @ 260°C
for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
Moisture Resistance
±(0.5% + 0.01 ohm) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
±(1.0% + 0.01 ohm)
±(1% + 0.01 ohm)
±(1% + 0.01 ohm)
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
1200 gram push from underside of mounted chip for 60
seconds
Chip mounted in center of 90mm long board, deflected 5mm
so as to exert pull on chip contacts for 10 seconds
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: [phone] • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
PPS-1 Series Issue December 2008 Sheet 1 of 2