MRC1-50-1000-C-BLK Datasheet, PDF (1/2 Pages) IRC - a TT electronics Company. – Metal Glaze High Power Density Surface Mount Power Resistor

Metal Glaze^™ High Power
Density Surface Mount
Power Resistor
MRC Series
• 1/2 watt in 1/8 watt package
• 1 watt in 1/2 watt package (2010 footprint)
• MRC1/2: 0.05 Ω to 1.0 Ω
(contact factory for higher values)
• 150°C maximum operating temperature
• Superior surge handling capability
Metal Glaze^™ thick film
element fired at 1000°C to
solid ceramic substrate
High temperature
dielectric coating
60/40 Solder over nickel barrier
Environmental Data
Size Industry
Code¹ Footprint
IRC
Type
Max.
Working Max. Resistance Tolerance TCR
Power Rating Voltage² Voltage Range (ohms)³ (±%)³ (ppm/°C)³
0.1 to 0.99
1,2,5
100
C
1206 MRC1/2 1/2W @ 70°C
200
400
1.0 to 10K
1,2,5
50,100
20 to 10K
0.25, 0.5
50,100
0.05 to 0.099
2,5
200
E
2010
MRC1 1W @ 70°C
350
700
0.10 to 1.0
1,2,5
100
Product
Catagory
Low Range
Standard
Tight Tolerance
Low Range
Low Range
MRC Applications:
The MRC1/2 will dissipate 1/2 watt at 70°C on a 1206 footprint, while the MRC 1 will dissipate 1 watt at 70°C on
a 2010 footprint. The MRC is recommended for applications where board real estate is a major concern. Due
to high power density and superior surge handling capability, it is also recommended as a direct replacement on
existing board designs where standard 1206 and 2010 resistors are marginal or failing.
Environmental Data
Characteristics
Maximum Change
Test Method
Temperature Coefficient
As specified
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
Thermal Shock
±(0.5% + 0.01Ω)
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
Low Temperature Operation
±(0.25% + 0.01Ω)
Short Time Overload
±(1.0% + 0.01Ω)
High Temperature Exposure
±(0.5% + 0.01Ω)
Resistance to Bonding Exposure ±(0.25% + 0.01Ω)
Solderability
95% minimum coverage
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x _√ PxR for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7
(Reflow soldered to board at 260°C for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
Moisture Resistance
±(0.5% + 0.01Ω)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
±(1.0% + 0.01Ω)
±(1% + 0.01Ω)
no mechanical damage
±(1% + 0.01Ω)
no mechanical damage
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
1200 gram push from underside of mounted chip
for 60 seconds
Chip mounted in center of 90mm long board, deflected 5mm
so as to exert pull on chip contacts for 10 seconds
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Wirewound and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: [phone] • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
MRC Series Issue June 2008 Sheet 1 of 2