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ISL54000 Datasheet, PDF (9/11 Pages) Intersil Corporation – Integrated Audio Amplifier Systems
ISL54000, ISL54001, ISL54002
large copper pad and multiple vias to the GND plane. The
vias should be plugged and tented with plating and solder
mask to ensure good thermal conductivity.
Best thermal performance is achieved with the largest
practical copper ground plane area.
PCB Layout Considersations and Power
Supply Bypassing
To maintain the highest load dissipation and widest output
voltage swing the power supply PCB traces and the traces
that connect the output of the drivers to the speaker loads
should be made as wide as possible to minimize losses due
to parasitic trace resistance.
Proper supply bypassing is necessary for high power supply
rejection and low noise performance. A filter network
consisting of a 10µF capacitor in parallel with a 0.1µF
capacitor is recommended at the voltage regulator that is
providing the power to the ISL54000, ISL54001, and
ISL54002 IC.
Local bypass capacitors of 0.1µF should be put at each VDD
pin of the ISL54000, ISL54001, ISL54002 devices. They
should be located as close as possible to the pin, keeping
the length of leads and traces as short as possible.
A 1µF capacitor from the REF pin (pin 10) to GND is needed
for optimum PSRR and internal bias voltage stability.
Typical Performance Curves TA = +25°C, Unless Otherwise Specified.
1.0
0.9 VDD = 5V
0.8 BTL
0.7 RL = 8Ω
0.6 PO = 800mW
1.0
0.9 VDD = 3.6V
0.8 BTL
0.7 RL = 8Ω
0.6 PO = 200mW
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
0.1
20
50 100 200 500 1k 2k
5k
FREQUENCY (Hz)
FIGURE 1. THD+N vs FREQUENCY
10k 20k
0.1
20
50 100 200 500 1k 2k
5k
FREQUENCY (Hz)
FIGURE 2. THD+N vs FREQUENCY
10k 20k
10.0
5.00
VDD = 5V
BTL
RL = 8Ω
2.00 f = 1kHz
1.00
0.50
0.20
0.10
0.05
0.02
0.01
10m 20m
50m 100m 200m
500m 1
OUTPUT POWER (W)
FIGURE 3. THD+N vs OUTPUT POWER
10.0
5.00
2.00
VDD = 3.6V
BTL
RL = 8Ω
f = 1kHz
1.00
0.50
0.20
0.10
0.05
0.02
0.01
10m
20m
40m 70m 100m 200m
OUTPUT POWER (W)
FIGURE 4. THD+N vs OUTPUT POWER
600m
9
FN6458.2
October 17, 2007