HIP2100IBZT Datasheet, PDF (9/12 Pages) Intersil Corporation – 100V/2A Peak, Low Cost, High Frequency Half Bridge Driver

HIP2100
Dual Flat No-Lead Plastic Package (DFN)
Micro Lead Frame Plastic Package (MLFP)
2X
A
D
0.15 C A
D/2
D1
D1/2
N
2X
0.15 C B
6
INDEX
AREA
0.15 C B
2X
0.15 C A
2X
4X 0
123
TOP VIEW
C
SEATING
PLANE
SIDE VIEW
E1/2
E/2
E1
E
9
B
A2 _A
A3 A1
// 0.10 C
0.08 C
6
INDEX
AREA
E2
78
E2/2
78
D2
(Nd-1)Xe
REF.
1 23
D2/2
NX k
N N-1
e
4X P
NX b
5
0.10 M C A B
BOTTOM VIEW
NX b
5
CL
A1
L⁵
CC
TERMINAL TIP
e
FOR EVEN TERMINAL/SIDE
L12.4x4A
12 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE
SYMBOL
A
A1
A2
A3
b
D
D1
D2
E
E1
E2
e
k
L
N
Nd
P
θ
MIN
-
0.00
-
0.18
2.65
1.43
0.635
0.30
0.24
-
MILLIMETERS
NOMINAL
0.85
0.01
0.65
0.20 REF
0.23
4.00 BSC
3.75 BSC
2.80
4.00 BSC
3.75 BSC
1.58
0.50 BSC
-
0.40
12
6
0.42
-
MAX
0.90
0.05
0.70
0.30
2.95
1.73
-
0.50
0.60
12
NOTES
-
-
-
-
5, 8
-
-
7, 8
-
-
7, 8
-
-
8
2
3
-
-
Rev. 0 8/03
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
2. N is the number of terminals.
3. Nd refer to the number of terminals on D.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land Pattern
Design efforts, see Intersil Technical Brief TB389.
9. COMPLIANT TO JEDEC MO-229-VGGD-2 ISSUE C except for
the L dimension.
9
FN4022.14