HCTS85MS Datasheet, PDF (9/10 Pages) Intersil Corporation – Radiation Hardened 4-Bit Magnitude Comparator

HCTS85MS
Die Characteristics
DIE DIMENSIONS:
100 x 100 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS85MS
(A<B)IN
B3
VCC
A3
(2)
(1)
(16)
(15)
(A=B)IN(3)
(A>B)IN(4)
(A<B)OUT(5)
(A=B)OUT(6)
(14) B2
(13) A2
(12) A1
(11) B1
(7)
(8)
(9)
(10)
(A>B)OUT
GND
B0
A0
9
Spec Number 518624