HCTS245MS Datasheet, PDF (9/10 Pages) Intersil Corporation – Radiation Hardened Octal Bus Transceiver, Three-State, Non-Inverting

Die Characteristics
DIE DIMENSIONS:
124 x 110 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS245MS
HCTS245MS
A0 (2)
A1 (3)
A2 (4)
A3 (5)
A4 (6)
A5 (7)
(18) B0
(17) B1
(16) B2
(15) B3
(14) B4
(13) B5
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS245 is TA14417A.
Spec Number 518615
622