HCTS153MS Datasheet, PDF (9/10 Pages) Intersil Corporation – Radiation Hardened Dual 4-Input Multiplexer

Die Characteristics
DIE DIMENSIONS:
2.13mm x 2.13mm
84 mils x 84 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
S1
(2)
HCTS153MS
HCTS153MS
1E
VCC
2E
(1)
(16)
(15)
1I3 (3)
1I2 (4)
1I1 (5)
1I0 (6)
(14) S0
(13) 2I3
(12) 2I2
(11) 2I1
(10) 2I0
(7)
(8)
(9)
Y1
GND
Y2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS153 is TA14469A.
Spec Number 518609
548