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| HCTS112MS Datasheet, PDF (9/10 Pages) Intersil Corporation – Radiation Hardened Dual JK Flip-Flop | |||
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Die Characteristics
DIE DIMENSIONS:
89 x 88 mils
2.25 x 2.24mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÃ
± 1kÃ
GLASSIVATION:
Type: SiO2
Thickness: 13kÃ
± 2.6kÃ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
K1
(2)
HCTS112MS
HCTS112MS
CP1
(1)
VCC
(16)
J1 (3)
S1 (4)
Q1 (5)
Q1 (6)
(15) R1
(14) R2
(13) CP2
(12) K2
Q2 (7)
(11) J2
(8)
GND
(9)
(10)
Q2
S2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS112 is TA14441A.
Spec Number 518603
498
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