HCS74MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened Dual-D Flip-Flop with Set and Reset

Die Characteristics
DIE DIMENSIONS:
89 x 88 mils
2.25 x 2.24mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
D1
(2)
CP1 (3)
HCS74MS
HCS74MS
R1
(1)
VCC
(14)
NC
S1 (4)
Q1 (5)
Q1 (6)
(7)
(8)
(9)
GND
Q2
Q2
91
(13) R2
(12) D2
NC
(11) CP2
(10) S2
Spec Number 518772