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| HCS273MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened Octal D Flip-Flop | |||
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Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÃ
± 1kÃ
GLASSIVATION:
Type: SiO2
Thickness: 13kÃ
± 2.6kÃ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
D0
(3)
HCS273MS
HCS273MS
Q0
MR
VCC
Q7
(2)
(1)
(20)
(19)
D1 (4)
Q1 (5)
Q2 (6)
(18) D7
(17) D6
(16) Q6
(15) Q5
D2 (7)
(14) D5
(8)
(9)
D3
Q3
(10) (11)
GND CP
(12)
(13)
Q4
D4
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS273 is TA14307B.
Spec Number 518767
344
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