HCS165MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened Inverting 8-Bit Parallel-Input/Serial Output Shift Register

HCS165MS
Die Characteristics
DIE DIMENSIONS:
95 x 94 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
< 2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
HCS165MS
CP
PL
VCC
CE
D3
(2)
(1)
(16)
(15)
(14)
D4 (3)
D5 (4)
D6 (5)
(13) D2
(12) D1
(11) D0
(6)
(7)
(8)
(9)
(10)
D7
Q7
GND
Q7
DS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS165 is TA14385A.
Spec Number 518757
248