CD4020BMS Datasheet, PDF (9/10 Pages) Intersil Corporation – CMOS Ripple-Carry Binary Counter/Dividers

CD4020BMS, CD4024BMS, CD4040BMS
Typical Performance Characteristics (Continued)
10⁵ ₈
6
AMBIENT TEMPERATURE (T_A) = +25^oC
4
2
10⁴ ₈
6
4
2
10³ ₈
6
4
SUPPLY VOLTAGE (VDD) = 5V
10V
10V
5V
2
10² ₈
6
4
CD = 15pF
CL = 50pF
2
10
2 4 68 2 4 68 2 4 68 2 4 68 2 4 68
1
10
10²
10³
10⁴
10⁵
INPUT PULSE FREQUENCY (fφ) (kHz)
FIGURE 10. TYPICAL DYNAMIC POWER DISSIPATION AS A
FUNCTION OF INPUT PULSE FREQUENCY FOR
CD4020BMS
∅
R
∅
*
Q¹
p
p
n
Rn
R
Q
∅
∅
∅
∅
p
p
n
n
Q
∅
∅
* ON FIRST STAGE ONLY
FIGURE 11. DETAIL OF TYPICAL FLIP-FLOP STAGES
Chip Dimensions and Pad Layouts
Dimensions in parentheses are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10^-3 inch)
DIMENSIONS AND PAD LAYOUT FOR CD4020BMS. DIMEN-
SIONS AND PAD LAYOUT FOR CD4040BMS ARE IDENTICAL
DIMENSIONS AND PAD LAYOUT FOR CD4024BMSH
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
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