HS-0506RH Datasheet, PDF (8/14 Pages) Intersil Corporation – Radiation Hardened Single 16/Differential 8 Channel CMOS Analog Multiplexer

HS-0506RH, HS-0507RH
Intersil Space Level Product Flow -Q
Wafer Lot Acceptance (All Lots) Method 5007
(Includes SEM) (Note 1)
GAMMA Radiation Verification (Each Wafer) Method 1019,
4 Samples/Wafer, 0 Rejects
100% Nondestructive Bond Pull, Method 2023
Sample - Wire Bond Pull Monitor, Method 2011
Sample - Die Shear Monitor, Method 2019 or 2027
100% Internal Visual Inspection, Method 2010, Condition A
100% Temperature Cycle, Method 1010, Condition C,
10 Cycles
100% Constant Acceleration, Method 2001, Condition per
Method 5004
100% PIND, Method 2020, Condition A
100% External Visual
100% Serialization
100% Initial Electrical Test (T0)
100% Static Burn-In, Condition A or B, 72 hrs. min., +125^oC
min., Method 1015
100% Interim Electrical Test 1 (T1)
100% Delta Calculation (T0-T1)
100% PDA 1, Method 5004 (Note 2)
100% Dynamic Burn-In, Condition D, 240 hrs., +125^oC or
Equivalent, Method 1015
100% Interim Electrical Test 2 (T2)
100% Delta Calculation (T0-T2)
100% PDA 2, Method 5004 (Note 2)
100% Final Electrical Test
100% Fine/Gross Leak, Method 1014
100% Radiographic (X-Ray), Method 2012 (Note 3)
100% External Visual, Method 2009
Sample - Group A, Method 5005 (Note 4)
Sample - Group B, Method 5005 (Note 5)
Sample - Group D, Method 5005 (Notes 5 and 6)
100% Data Package Generation (Note 7)
NOTES:
1. Modified SEM Inspection, not compliant to MIL-STD-883, Method 2018. This device does not meet the Class S minimum metal step
coverage of 50%. The metal does meet the current density requirement of <2 E⁵ A/cm². Data provided upon request.
2. Failures from subgroup 1 and deltas are used for calculating PDA. The maximum allowable PDA = 5%.
3. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004.
4. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005.
5. Group B and D inspections are optional and will not be performed unless required by the P.O. When required, the P.O. should include
separate line items for Group B test, Group B samples, Group D test and Group D samples.
6. Group D Generic Data, as defined by MIL-I-38535, is optional and will not be supplied unless required by the P.O. When required, the
P.O. should include a separate line item for Group D generic data. Generic data is not guaranteed to be available and is therefore not
available in all cases.
7. Data Package Contents:
• Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number,
Quantity).
• Wafer Lot Acceptance Report (Method 5007). Includes reproductions of SEM photos with percent of step coverage.
• GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, Test Package used, Specification Numbers, Test
equipment, etc. Radiation Read and Record data on file at Intersil.
• X-Ray report and film. Includes penetrometer measurements.
• Screening, Electrical, and Group A attributes (Screening attributes begin after package seal).
• Lot Serial Number Sheet (Good units serial number and lot number).
• Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test.
• Group B and D attributes and/or Generic data is included when required by the P.O.
• The Certificate of Conformance is a part of the shipping invoice and is not part of the Data Book. The Certificate of Conformance is signed
by an authorized Quality Representative.
Spec Number 518860
8