HCTS4002MS Datasheet, PDF (8/9 Pages) Intersil Corporation – Radiation Hardened Dual 4-Input NOR Gate

Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2.20mm x 2.24mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS4002MS
HCTS4002MS
A1 (2)
B1 (3)
C1 (4)
D1 (5)
(12) D2
(11) C2
(10) B2
(9) A2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS4002 is TA14429A.
Spec Number 518632
725