HCTS00MS Datasheet, PDF (8/9 Pages) Intersil Corporation – Radiation Hardened Quad 2-Input NAND Gate

Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2.20mm x 2.24mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
HCTS00MS
HCTS00MS
B1 (2)
Y1 (3)
A2 (4)
B2 (5)
(12) A4
(11) Y4
(10) B3
(9) A3
Spec Number 518774
377