HCS32MS Datasheet, PDF (8/8 Pages) Intersil Corporation – Radiation Hardened Quad 2-Input OR Gate

Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2.20 x 2.2mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
HCS32MS
HCS32MS
A1
VCC
B4
(1)
(14)
(13)
B1 (2)
Y1 (3)
A2 (4)
B2 (5)
(6)
(7)
(8)
Y2
GND
Y3
80
(12) A4
(11) Y4
(10) B3
(9) A3
Spec Number 518768