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CD4070BMS Datasheet, PDF (8/8 Pages) Intersil Corporation – CMOS Quad Exclusive OR and Exclusive NOR Gates
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CD4070BMS, CD4077BMS
Typical Performance Characteristics (Continued)
AMBIENT TEMPERATURE (TA) = +25oC
LOAD CAPACITANCE (CL) = 50pF
300
200
100
0
5
10
15
20
SUPPLY VOLTAGE (VDD) (V)
FIGURE 9. TYPICAL PROPAGATION DELAY TIME AS A
FUNCTION OF SUPPLY VOLTAGE
105 6
4
AMBIENT TEMPERATURE (TA) = +25oC
2
104 6
4
2
103 6
4
2
102 6
4
2
SUPPLY VOLTAGE
(VDD) = 15V
10V
10V
10
6
4
2
16
4
2
10-1
2
10-1
4 68 2
1
5V
LOAD CAPACITANCE
CL = 50pF
CL = 15pF
4 68 2 4 68 2 4 68 2 4 68
10
102
103
104
INPUT FREQUENCY (fI) (kHz)
FIGURE 10. TYPICAL DYNAMIC POWER DISSIPATION AS A
FUNCTION OF INPUT FREQUENCY
Chip Dimensions and Pad Layout
CD4077BMSH
Dimensions and pad layout for CD4070BMSH are
identical
Dimensions in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10-3 inch).
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
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