CD4008BMS Datasheet, PDF (8/8 Pages) Intersil Corporation – CMOS 4-Bit Full Adder With Parallel Carry Out

CD4008BMS
Typical Performance Characteristics (Continued)
AMBIENT TEMPERATURE (T_A) = +25^oC
AMBIENT TEMPERATURE (T_A) = +25^oC
30
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
25
20
15
10V
10
5
5V
0
5
10
15
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
FIGURE 8. TYPICAL OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS
15.0
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
12.5
10.0
10V
7.5
5.0
2.5
5V
0
5
10
15
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
FIGURE 9. MINIMUM OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS
10⁶ _{AMBIENT TEMPERATURE (TA) = +25oC}
10⁵
SUPPLY VOLTAGE (VDD) = 15V
10⁴
10V
10³
5V
10²
5V
3.5V
10
LOAD CAPACITANCE (CL) = 15pF
(CL) = 50pF
1
10
10²
10³
10⁴
INPUT FREQUENCY (fφ) (kHz)
FIGURE 10. TYPICAL DISSIPATION CHARACTERISTICS
Chip Dimensions and Pad Layouts
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
Dimensions in parentheses are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10^-3 inch)
7-682