ISL15100 Datasheet, PDF (7/9 Pages) Intersil Corporation – Single differential driver

ISL15100
PC Board Design Recommendation
To minimize parasitic capacitance in the ISL15100 design,
consider laying out short output traces. Also, select low
capacitance protection devices, and use line transformers with
low interwinding capacitance in the signal path.
The supply decoupling capacitors must be close to the supply
pins to minimize parasitic inductance in the supply paths. High
frequency load currents are pulled through these capacitors, so
placement of the 0.1µF capacitors close to the supply pin(s)
improves dynamic performance. The higher value 4.7µF
capacitors provide low frequency decoupling, so they can be
placed farther from the supply pins.
The ISL15100’s thermal pad (EP) should be connected to V_S-
(ground in single supply applications). For good thermal control,
include a thermal pad in the layout footprint, as shown in the
“Typical Recommended Land Pattern” on the “Package Outline
Drawing” page. Adding vias to this thermal pad helps dissipate
heat away from the package. The ISL15100 evaluation board
uses four 10mil (hole size) vias with 20mil diameter pads.
Thermal Resistance and Power Dissipation
Thermal resistance for junction to ambient, T_JA, is +53°C/W. The
power dissipation at 12V supply is 600mW. The ambient
temperature allowed given the maximum junction temperature
of +150°C is:
T_A = T_J – θ_JA × Pd
T_A = +150°C – 53°(C ⁄ W)∗600mW = +118°C
(EQ. 1)
OUTA
R4
0
Rext4
56.2
Rext1
243
Rext2
243
TP1
Rext3
TP2
22 2W
R3
OUTB
0
TP9
INA
R9
INA 100 R1
0
TP12
VS+
J1
VS+
VS+
J2
GND
J3
VS-
TP4
GND
TP5 TP14
GND GND
TP13
VS-
VS-
7
D1
OPEN
D2
OPEN
D3
VS- ^OPEN
VS+
D4
OPEN
VS+
RLA
3.9 1/4 W
RFA
1k
C3 VS+
+
4.7uF
L1 RLB
3.9 1/4 W
C4
RFB
0.1uf
1k
RGA
OPEN
RSA
49.9
1 _NC
2
_
3
+
4 _GND
U1
ISL15100IRZ
NC ¹²
_
11
+
10
C1 ⁹
RGB
OPEN
C2
0.1uf L2
C1
+
4.7uF ^VS-
RCG
133
FIGURE 6. ISL15100 EVALUATION BOARD
TP10
INB
RSB
49.9
R10
R2
100
0
INB
VS+
R11
10K
SW1:1
1
4
SW1:2
D5
2
3
4.3V ZENER DIODE
2.9V@ 300 uA
S/N=CMHZ5229B
FN8577.0
September 19, 2013