LP3995 Datasheet, PDF (6/16 Pages) National Semiconductor (TI) – Micropower 150mA CMOS Voltage Regulator with Active Shutdown

Symbol
Parameter
DEVICE OUTPUT: 2.5 ≤ V_OUT ≤ 3.3V
ΔV_OUT
Output Voltage Tolerance
Conditions
I_OUT = 1 mA
Line Regulation Error
micro SMD
Load Regulation Error
LLP
Load Regulation Error
Dropout Voltage
PSRR
Power Supply Rejection Ratio
(Note 11)
FULL V_OUT RANGE
I_LOAD
Load Current
I_Q
Quiescent Current
I_SC
Short Circuit Current Limit
E_N
Output Noise Voltage ((Note 11))
T_SHUTDOWN Thermal Shutdown
ENABLE CONTROL CHARACTERISTICS
I_EN
Maximum Input Current at
V_EN Input
V_IL
Low Input Threshold
V_IH
High Input Threshold
TIMING CHARACTERISTICS
T_ON
T_OFF
Turn On Time (Note 11)
Turn Off Time (Note 11)
V_IN = (V_OUT(NOM)+1.0V) to 6.0V,
I_OUT = 1 mA
I_OUT = 1 mA to 150 mA
I_OUT = 1 mA to 150 mA
I_OUT = 1 mA
I_OUT = 150 mA
f = 1 kHz, I_OUT = 1 mA
f = 10 kHz, I_OUT = 1 mA
(Notes 10, 11)
V_EN = 1.5V, I_OUT = 0 mA
V_EN = 1.5V, I_OUT = 150 mA
V_EN = 0.4V
BW = 10 Hz to 100 kHz,
V_IN = 4.2V, I_OUT = 1mA
Temperature
Hysteresis
V_EN = 0.0V and V_IN = 6.0V
To 95% Level (Note 12)
To 5% Level (Note 13)
Typical
0.0004
0.002
0.4
60
60
50
85
140
0.003
450
25
160
20
0.001
30
175
Limit
Min
Max
Units
-2
−3
−0.1
2
% of V_OUT
3
(NOM)
0.1
%/V
0.002
%/mA
0.005
2
100
%/mA
mV
dB
0
µA
150
200
µA
1.5
mA
µVrms
°C
µA
0.4
V
0.9
V
µs
µs
Note 3: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 4: All voltages are with respect to the potential at the GND pin.
Note 5: For information regarding micro SMD and LLP packages please refer to the following application notes;
AN-1112 Micro SMD Package Wafer Level Chip Scale Package,
AN-1187. Leadless Leadframe Package.
Note 6: Internal Thermal shutdown circuitry protects the device from permanent damage.
Note 7: In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to be derated.
Maximum ambient temperature (T_A(max)) is dependant on the maximum operating junction temperature (T_J(max-op)), the maximum power dissipation (P_D(max)), and
the junction to ambient thermal resistance in the application (θ_JA). This relationship is given by :-
T_A(max) = T_J(max-op) − (P_D(max) × θ_JA)
Note 8: Junction to ambient thermal resistance is highly dependant on the application and board layout. In applications where high thermal dissipation is possible,
special care must be paid to thermal issues in the board design.
Note 9: The human body model is an 100 pF discharge through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged directly
into each pin.
Note 10: The device maintains a stable, regulated output voltage without load.
Note 11: This electrical specification is guaranteed by design.
Note 12: Time from V_EN = 0.9V to V_OUT = 95% (V_OUT(NOM))
Note 13: Time from V_EN = 0.4V to V_OUT = 5% (V_OUT(NOM))
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