ISL6313 Datasheet, PDF (6/33 Pages) Intersil Corporation – Two-Phase Buck PWM Controller with Integrated MOSFET Drivers for Intel VR11 and AMD Applications

ISL6313
Absolute Maximum Ratings
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
Supply Voltage, PVCC . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +15V
BOOT Voltage, V_BOOT . . . . . . . . . . . . . . GND - 0.3V to GND + 36V
BOOT to PHASE Voltage, V_BOOT-PHASE . . . . . . -0.3V to 15V (DC)
-0.3V to 16V (<10ns, 10µJ)
PHASE Voltage, V_PHASE . . . . . . . GND - 0.3V to 15V (PVCC = 12)
GND - 8V (<400ns, 20µJ) to 24V (<200ns, V_{BOOT - PHASE} = 12V)
UGATE Voltage, V_UGATE. . . . . . . . V_PHASE - 0.3V to V_BOOT + 0.3V
V_PHASE - 3.5V (<100ns Pulse Width, 2µJ) to V_BOOT + 0.3V
LGATE Voltage, V_LGATE . . . . . . . . . . . GND - 0.3V to PVCC + 0.3V
GND - 5V (<100ns Pulse Width, 2µJ) to PVCC + 0.3V
Input, Output, or I/O Voltage . . . . . . . . . GND - 0.3V to VCC + 0.3V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . Class I JEDEC STD
Thermal Information
Thermal Resistance
θ_JA (°C/W) θ_JC (°C/W)
QFN Package (Notes 1, 2) . . . . . . . . . .
32
2.0
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
Recommended Operating Conditions
VCC Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V ±5%
PVCC Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . +5V to 12V ±5%
Ambient Temperature (ISL6313CRZ) . . . . . . . . . . . . . 0°C to +70°C
Ambient Temperature (ISL6313IRZ) . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Stress above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational section of this specification is not implied.
NOTES:
1. θ_JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
2. For θ_JC, the “case temp” location is the center of the exposed metal pad on the package underside.
3. Parameter magnitude guaranteed by design. Not 100% tested.
Electrical Specifications Recommended Operating Conditions, Unless Otherwise Specified.
PARAMETER
TEST CONDITIONS
MIN
TYP
BIAS SUPPLIES
Input Bias Supply Current
Gate Drive Bias Current - PVCC Pin
VCC POR (Power-On Reset)
Threshold
I_VCC; EN = high
I_PVCC; EN = high
VCC rising
VCC falling
10
14
2
4.2
4.25
4.38
3.75
3.87
PVCC POR (Power-On Reset)
Threshold
PVCC rising
PVCC falling
4.25
4.38
3.75
3.87
PWM MODULATOR
Oscillator Frequency Accuracy, F_SW R_T = 100kΩ (± 0.1%)
(ISL6313CRZ)
225
250
Oscillator Frequency Accuracy, F_SW R_T = 100kΩ (± 0.1%)
(ISL6313IRZ)
215
250
Adjustment Range of Switching
Frequency
(Note 3)
0.08
-
Oscillator Ramp Amplitude, V_PP
CONTROL THRESHOLDS
(Note 3)
-
1.50
EN Rising Threshold
0.84
0.85
EN Hysteresis
-
100
REFERENCE AND DAC
System Accuracy (1.000V to 1.600V)
-0.5
-
System Accuracy (0.600V to 1.000V)
-1.0
-
MAX
UNITS
17
mA
6
mA
4.50
V
4.00
V
4.50
V
4.00
V
275
kHz
280
kHz
1.0
MHz
-
V
0.88
V
-
mV
0.5
%
1.0
%
6
FN6448.0
March 5, 2007