ISL28107_1009 Datasheet, PDF (6/32 Pages) Intersil Corporation – Precision Single, Dual and Quad Low Noise Operational Amplifiers

ISL28107, ISL28207, ISL28407
Absolute Maximum Ratings
Maximum Supply Voltage . . . . . . . . . . . . . . . . . . . . . . 42V
Maximum Differential Input Current . . . . . . . . . . . . . 20mA
Maximum Differential Input Voltage . . . (V-) - 0.5V to (V+) + 0.5V
Min/Max Input Voltage . . . . . . . . (V-) - 0.5V to (V+) + 0.5V
Max/Min Input Current for Input Voltage >V+ or <V- . . . . ±20mA
Output Short-Circuit Duration (1 Output at a Time) . . . Indefinite
ESD Tolerance
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . 4.5kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . 500V
Charged Device Model . . . . . . . . . . . . . . . . . . . . . . 1.5kV
Thermal Information
Thermal Resistance (Typical)
θ_JA (°C/W) θ_JC (°C/W)
8 Ld SOIC (ISL28107, Notes 4, 5) . . . 120
60
8 Ld SOIC (ISL28207, Notes 4, 5) . . . 105
50
8 Ld MSOP (ISL28107, Notes 4, 5) . . 155
50
8 Ld TDFN (ISL28107, Notes 6, 7) .
48
7
8 Ld TDFN (ISL28207, Notes 6, 7) .
43
2
14 Ld SOIC (ISL28407) . . . . . . . . TBD
TBD
14 Ld TSSOP (ISL28407) . . . . . . . TBD
TBD
16 Ld QFN (ISL28407) . . . . . . . . . TBD
TBD
Storage Temperature Range . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Ambient Operating Temperature Range. . . . -40°C to +125°C
Maximum Operating Junction Temperature . . . . . . . +150°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
4. θ_JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
5. For θ_JC, the “case temp” location is taken at the package top center.
6. θ_JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features. See Tech Brief TB379.
7. For θ_JC, the “case temp” location is the center of the exposed metal pad on the package underside.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless
otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: T_J = T_C = T_A
Electrical Specifications V_S ±15V, V_CM = 0, V_O = 0V, R_L = Open, T_A= +25°C, unless otherwise noted. Boldface limits
apply over the operating temperature range, -40°C to +125°C. Temperature data
established by characterization.
PARAMETER
DESCRIPTION
CONDITIONS
MIN
MAX
(Note 8) TYP (Note 8) UNIT
V_OS
Offset Voltage Magnitude;
SOIC Package
-75
5
-140
75
µV
140
µV
Offset Voltage Magnitude;
MSOP Package
-100
5
-180
100
µV
180
µV
Offset Voltage Magnitude;
TDFN Package
ISL28107
-100
10
-190
100
µV
190
µV
ISL28207
-100
10
100
µV
-175
175
µV
TCV_OS
Offset Voltage Drift; SOIC
Package
-0.65 0.1
0.65 µV/°C
Offset Voltage Drift; MSOP
Package
-0.85 0.1
0.85 µV/°C
Offset Voltage Drift; TDFN
Package
ISL28107
ISL28207
-0.9
0.1
-0.75 0.1
0.9
0.75
µV/°C
µV/°C
I_B
Input Bias Current
T_A = -40°C to +85°C
T_A = -40°C to +125°C
-300
15
300
pA
-600
600
pA
6
FN6631.3
September 9, 2010