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DG201_01 Datasheet, PDF (6/7 Pages) Intersil Corporation – CMOS Quad SPST Analog Switch
Die Characteristics
DIE DIMENSIONS:
94 mils x 101 mils x 14 mils
METALLIZATION:
Type: Al
Thickness: 10kÅ
Metallization Mask Layout
D1
(2)
S1 (3)
DG201
PASSIVATION:
Type: SiO2/Si3N4
SiO2 Thickness: 7kÅ
Si3N4 Thickness: 8kÅ
WORST CASE CURRENT DENSITY:
1 x 105 A/cm2
DG201
IN1
IN2
(1)
(16)
D2
(15)
(14) S2
V- (4)
GND (5)
(13) V+ (SUBSTRATE)†
(12) VREF
S4 (6)
(7)
D4
† BACKSIDE OF CHIP IS V+
(8)
(9)
IN4
IN3
(11) S3
(10)
D3
6