ISL6609A_14 Datasheet, PDF (5/12 Pages) Intersil Corporation – Synchronous Rectified MOSFET Driver

ISL6609, ISL6609A
Absolute Maximum Ratings
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input Voltage (V_EN, V_PWM) . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V
BOOT Voltage (V_BOOT-GND). . . -0.3V to 27V (DC) or 36V (<200ns)
BOOT To PHASE Voltage (V_BOOT-PHASE) . . . . . . -0.3V to 7V (DC)
-0.3V to 9V (<10ns)
PHASE Voltage . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 27V (DC)
GND -8V (<20ns Pulse Width, 10μJ) to 30V (<100ns)
UGATE Voltage . . . . . . . . . . . . . . . . V_PHASE - 0.3V (DC) to V_BOOT
V_PHASE - 5V (<20ns Pulse Width, 10μJ) to V_BOOT
LGATE Voltage . . . . . . . . . . . . . . . GND - 0.3V (DC) to VCC + 0.3V
GND - 2.5V (<20ns Pulse Width, 5μJ) to VCC + 0.3V
Ambient Temperature Range . . . . . . . . . . . . . . . . . .-40°C to +125°C
Thermal Information
Thermal Resistance (Notes 1, 2, 3)
θ_JA(°C/W) θ_JC(°C/W)
SOIC Package (Note 1) . . . . . . . . . . . .
110
N/A
QFN Package (Notes 2, 3). . . . . . . . . .
95
36
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-40°C to 100°C
Maximum Operating Junction Temperature . . . . . . . . . . . . . . 125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. θ_JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2. θ_JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features.
3. θ_JC, “case temperature” location is at the center of the package underside exposed pad. See Tech Brief TB379 for details.
Electrical Specifications
These specifications apply for T_A = -40°C to 100°C, unless otherwise noted. Parameters with MIN and/or MAX
limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNITS
VCC SUPPLY CURRENT
Bias Supply Current
POR Rising
I_VCC
PWM pin floating, V_VCC = 5V
-
132
-
μA
-
3.4
4.2
POR Falling
2.2
3.0
-
Hysteresis
-
400
-
mV
PWM INPUT
Sinking Impedance
Source Impedance
Three-State Rising Threshold
Three-State Falling Threshold
Three-State Shutdown Holdoff Time
EN INPUT
R_{PWM_SNK}
R_{PWM_SRC}
V_VCC = 5V (100mV Hysteresis)
V_VCC = 5V (100mV Hysteresis)
t_TSSHD t_PDLU or t_PDLL + Gate Falling Time
2.75
4
5.5
kΩ
3
4.25 5.75
kΩ
-
1.70 2.00
V
3.10 3.41
-
V
-
20
-
ns
EN LOW Threshold
1.0
1.3
-
V
EN HIGH Threshold
-
1.6
2.0
V
SWITCHING TIME (See Figure 1 on Page 7)
UGATE Rise Time (Note 4)
LGATE Rise Time (Note 4)
UGATE Fall Time (Note 4)
LGATE Fall Time (Note 4)
UGATE Turn-Off Propagation Delay
LGATE Turn-Off Propagation Delay
t_RU
t_RL
t_FU
t_FL
t_PDLU
t_PDLL
V_VCC = 5V, 3nF Load
V_VCC = 5V, 3nF Load
V_VCC = 5V, 3nF Load
V_VCC = 5V, 3nF Load
V_VCC = 5V, Outputs Unloaded
V_VCC = 5V, Outputs Unloaded
-
8.0
-
ns
-
8.0
-
ns
-
8.0
-
ns
-
4.0
-
ns
-
18
-
ns
-
25
-
ns
5
FN9221.2
April 27, 2009