ISL6186 Datasheet, PDF (5/18 Pages) Intersil Corporation – USB Port Power Supply Controller

ISL6186
Absolute Maximum Ratings
Supply Voltage (VIN to GND, Note 7) . . . . . . . . . . . . . . . . . . . . . . . . . . . .6.5V
EN, FAULT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VIN
OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to VIN 0.3V
Output Current . . . . . . . . . . . . . . . . . Short Circuit Protected; Limited to 5A
ESD Rating
Human Body Model (Per MIL-STD-883 Method 3015.7) . . . . . . . . . . 3kV
Machine Model (Per MIL-STD-883 Method 3015.7) . . . . . . . . . . . . 300V
Latch Up (Tested per JESD-78B; Class 2, Level A) . . . . . . . . . . . . . . 100mA
Thermal Information
Thermal Resistance (Typical)
θ_JA (°C/W) θ_JC (°C/W)
8 Lead SOIC Package (Note 4) . . . . . . . . . . 120
N/A
8 Lead 3x3 DFN Package (Notes 5, 6) . . .
48
6
10 Lead 3x3 DFN Package (Notes 5, 6) . .
48
6
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Commercial Temperature Range . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial Temperature Range . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Supply Voltage Range (Typical). . . . . . . . . . . . . . . . . . . . . . . . . 2.5V to 5.5V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. θ_JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
5. θ_JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
6. For θ_JC, the “case temp” location is the center of the exposed metal pad on the package underside.
7. All voltages are relative to GND, unless otherwise specified.
Electrical Specifications V_IN = 5V, T_A = T_J, Unless Otherwise Specified. Boldface limits apply over the operating temperature
range, 0°C to +75°C or -40°C to +85°C.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
MAX
(Note 8) TYP (Note 8)
UNITS
POWER SWITCH
r_{DS(ON)_50} ON-Resistance at 5.0V (Pulse Tested) V_IN = 5V, I_OUT = 0.5A, T_A = T_J = +25°C
T_A = T_J = +85°C
r_{DS(ON)_33} ON-Resistance at 3.3V (Pulse Tested) V_IN = 3.3V, I_OUT = 0.5A, T_A = T_J = +25°C
T_A = T_J = +85°C
r_{DS(ON)_25} On Resistance at 2.5V (Pulse Tested) V_IN = 2.5V, I_OUT = 0.5A, T_A = T_J = +25°C
T_A = T_J = +85°C
V_{OUT_DIS} Disabled Output Voltage
V_IN = 5V, Switch Disabled, 50µA Load
R_{OUT_PD} Output Pull-Down Resistor
V_IN = 5V, Switch Disabled
t_R
V_OUT Rise Time
R_L = 10Ω, C_L = 10µF, 10% to 90%
t_F
Slow V_OUT Turn-off Fall Time
R_L = 10Ω, C_L = 10µF, 90% to 10%
CURRENT CONTROL
-
45
48
mΩ
-
50
54
mΩ
-
54
57
mΩ
-
61
64
mΩ
-
65
69
mΩ
-
74
79
mΩ
-
22
45
mV
3.4
5
6
kΩ
-
10
-
µs
-
200
-
µs
I_{OUT_CONT_5}
I_{OUT_CONT_5}
I_{OUT_CONT_5}
I_{OUT_CONT_3}
I_{OUT_CONT_3}
I_{OUT_CONT_3}
I_{OUT_CONT_2}
I_{OUT_CONT_2}
I_{OUT_CONT_2}
I_{OUT_CONT_2}
Maximum Continuous Current,
V_IN = 5V
Guaranteed by the Minimum I_trip
Current Specification
Maximum Continuous Current,
V_IN = 3.3V
Guaranteed by the Minimum I_trip
Current Specification
Maximum Continuous Current,
V_IN = 2.5V
ISL6186xA, B, E, F
ISL6186xC, D, G, H
ISL6186xI, J, K, L (10 Ld DFN)
ISL6186xA, B, E, F
ISL6186xC, D, G, H
ISL61861I, J, K, L (10 Ld DFN)
ISL6186xA, B, E, F
ISL61861C, D, G, H (SOIC)
ISL61862, ISL61863 C, D, G, H (DFN)
ISL61863I, J, K, L (10 Ld DFN)
-
-
1.5
A
-
-
3.0
A
-
-
3.6
A
-
-
1.5
A
-
-
2.5
A
-
-
2.7
A
-
1.2
-
A
-
1.8
-
A
-
2
-
A
-
2
-
A
5
FN7698.1
September 1, 2011