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ISL55143_15 Datasheet, PDF (4/14 Pages) Intersil Corporation – High-Speed 18V CMOS Comparators
ISL55141, ISL55142, ISL55143
Absolute Maximum Ratings
VCC to VEE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 19V
Input Voltages
PD, CVAX, CVBX, VINPX, VOH, VOL
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . (VEE -0.5V) to (VCC +0.5V)
Output Voltage
QAX, QBX . . . . . . . . . . . . . . . . . . . . . (VOL -0.5V) to (VOH +0.5V)
Thermal Information
Thermal Resistance (Typical, Note 8)
JA (°C/W) JC (°C/W)
16 Ld QFN Package (Notes 6, 7). . . . .
40
3
14 Ld TSSOP Package (Notes 4, 5) . .
100
31
20 Ld QFN Package (Notes 6, 7). . . . .
31
1.4
20 Ld TSSOP Package (Notes 4, 5) . .
76
25
36 Ld TQFN Package (Notes 6, 7). . . .
29
0.75
Maximum Junction Temperature (Plastic Plackage) . .
150°
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
4. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
5. For JC, the “case temp” location is taken at the package top center.
6. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
7. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
8. Device temperature is closely tied to data-rates, driver loads and overall pin activity. Review “Power Dissipation Considerations” on page 6 for
more information.
Recommended Operating Conditions
PARAMETER
SYMBOL
Device Power
Comparator Output High Rail
Comparator Output Low Rail
Common Mode Input Voltage Range
Ambient Temperature
Junction Temperature
VCC-VEE
VOH
VOL
VCM
TA
TJ
MIN
10
VEE+1
VEE+0.5
VEE
-40
TYP
15
27
MAX
18
VCC-0.5
VEE+6
VCC-5
+85
+125
UNITS
V
V
V
V
°C
°C
Electrical Specifications
PARAMETER
DC CHARACTERISTICS
Input Offset Voltage
Input Bias Current
Power-down Current
Power-down Time (Note 11)
Power-up Time (Note 11)
TIMING CHARACTERISTICS
Propagation Delay
Rise Time (Note 11)
Fall Time (Note 11)
Propagation Delay Mismatch
Maximum Operating Frequency
Min Pulse Width
COMPARATOR INPUT
Input Current
Test Conditions: VCC = 12V, VEE = -3V, VOH = 5V, VOL = 0V, PD = VEE, CLOAD = 15pF, TA = 25°C, unless
otherwise specified.
SYMBOL
TEST CONDITIONS
MIN
(Note 13)
TYP
MAX
(Note 13)
UNITS
VOS
IBIAS
IPD
tPD
tPU
CVAX = CVBX = 1.5V
VINPX - CV(A/B)X = ±5V
PD = VCC
tpd
tr
tf
tpd
FMAXR
tWIDR
Symmetry 50%
IIN
VINPX = VCC or VEE
-50
50
10
25
8
25
10
15
4.0
9.5
15
1.4
1.5
0.5
2
65
7.7
-100
0
100
mV
nA
µA
µs
µs
ns
ns
ns
ns
MHz
ns
nA
4
FN6230.4
August 13, 2015