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ISL55100B Datasheet, PDF (4/14 Pages) Intersil Corporation – Quad 18V Pin Electronics Driver/Window Comparator
ISL55100B
Absolute Maximum Ratings
VCC to VEE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 19V
VEXT to VEE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
Input Voltages
DATA, DRV EN, CVX, VH, VL, VINP, COMPX, LOWSWING
. . . . . . . . . . . . . . . . . . . . . . . . . . . . (VEE - 0.5V) to (VCC + 0.5V)
Output Voltages
DOUT . . . . . . . . . . . . . . . . . . . . . . . (VEE - 0.5V) to (VCC + 0.5V)
QX . . . . . . . . . . . . (COMP LOW - 0.5V) to (COMP HIGH + 0.5V)
Thermal Information
Thermal Resistance (Typical, Notes 1, 2) θJA (°C/W) θJC (°C/W)
72 Ld QFN Package. . . . . . . . . . . . . . .
23
2.0
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. θJA is measured in free air with the component mounted on high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379 and Tech Brief TB389 for details. Device temperature is closely tied to data-rates, driver loads and overall pin activity. Review
“Power Dissipation Considerations” on page 9 for more information.
2. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Recommended Operating Conditions
PARAMETER
Device Power-(VEXT = VEE) VEXT not used
Device Power-(VEXT = VEE + 5.5V)
VEXT Optional External Logic Power
Driver Output High Rail
Driver Output Low Rail
Comparator Output High Rail
Comparator Output Low Rail
Ambient Temperature
Junction Temperature
SYMBOL
VCC - VEE
VCC - VEE
VEXT - VEE
VH
VL
COMP-High
COMP-Low
TA
TJ
MIN
(Note 9)
12 (Note 6)
9 (Note 6)
5.5 (Note 6)
VEE + 1
VEE + 0.5
VEE + 1
VEE + 0.5
-40
-
TYP
15
15
5.75
-
-
-
-
-
-
MAX
(Note 9)
18
18
6.0
VCC - 0.5
VEE + 6
VCC - 0.5
VEE + 6
+85
+150
UNITS
V
V
V
V
V
V
V
°C
°C
Electrical Specifications
PARAMETER
Test Conditions: VCC = 12V, VEE = -3V, VH = 6V, VL = 0V, Comp-High = 5V, Comp Low = 0V, VEXT = VEE and
LOWSWING = VCC, +25°C; Unless Otherwise specified.
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
DRIVER DC CHARACTERISTICS
ISL55100B Output Resistance
ISL55100B DC Output Current
ROUTD IO = ±125mA, data not toggling
Iout D Per Individual driver
6
9
14
Ω
±125
-
-
mA
ISL55100B AC Output Current (Note 3) IOUTDAC Per Individual driver
-
600
-
mA
ISL55100A Minimum Output Swing
VOMIN VH = 200mV, VL = 0V
185
-
-
mV
Disabled HIZ Leakage Current
HIZ VOUT = VCC with VH = VL + VEE or
-1
0
1
µA
VOUT = VEE with VH = VL = VCC
DRIVER TIMING CHARACTERISTICS
Data± to DOUT Propagation Delay
tPD Lowswing Disabled (Note 5)
Lowswing Enabled (Note 5)
5
12
16
ns
6
13
17
ns
Driver Timing Skew, All Edges (Note 3)
-
<1
-
ns
Disable (HIZ) Time
tDIS DVREN± Transition from Enable to
Disable
15
18
26
ns
Enable Time
tEN DVREN± Transition from Disable to
13
15
23
ns
Enable: Lowswing Disabled (Note 5)
DVREN± Transition from Disable to
13
18
23
ns
Enable: Lowswing Enabled (Note 5)
4
FN6229.1
November 24, 2008