English
Language : 

ISL8484_06 Datasheet, PDF (3/13 Pages) Intersil Corporation – Ultra Low ON-Resistance, +1.65V to +4.5V, Single Supply, Dual SPDT Analog Switch
ISL8484
Absolute Maximum Ratings
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 4.7V
Input Voltages
NO, NC, IN (Note 2). . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V)
Output Voltages
COM (Note 2). . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V)
Continuous Current NO, NC, or COM . . . . . . . . . . . . . . . . . ±300mA
Peak Current NO, NC, or COM
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . . ±500mA
ESD Rating:
HBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>9kV
MM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>500V
CDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>1kV
Thermal Information
Thermal Resistance (Typical)
θJA (°C/W)
10 Ld 3x3 TDFN Package (Note 3) . . . . . . . . . . . . .
90
10 Ld MSOP Package (Note 4) . . . . . . . . . . . . . . . .
140
Maximum Junction Temperature (Plastic Package). . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C
(Lead Tips Only)
Operating Conditions
Temperature Range
ISL8484IX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. Signals on NC, NO, IN, or COM exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current ratings.
3. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications - 3V Supply
Test Conditions: V+ = +3.9V to +4.5V, GND = 0V, VINH = 1.4V, VINL = 0.5V (Notes 5, 7),
Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
TEMP (NOTE 6)
(NOTE 6)
(°C)
MIN
TYP
MAX UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
Full
0
V+
V
ON Resistance, RON
V+ = 3.9V, ICOM = 100mA, VNO or VNC = 0V to V+,
25
(See Figure 5)
Full
0.23
0.4
Ω
0.26
0.6
Ω
RON Matching Between Channels, V+ = 3.9V, ICOM = 100mA, VNO or VNC = Voltage at
25
0.03
Ω
∆RON
max RON, (Note 10)
Full
0.04
Ω
RON Flatness, RFLAT(ON)
V+ = 3.9V, ICOM = 100mA, VNO or VNC = 0V to V+,
25
0.03
Ω
(Note 8)
Full
0.04
Ω
NO or NC OFF Leakage Current, V+ = 4.5V, VCOM = 0.3V, 3V, VNO or VNC = 3V, 0.3V
25
INO(OFF) or INC(OFF)
Full
-100
-195
100
nA
195
nA
COM ON Leakage Current,
ICOM(ON)
V+ = 4.5V, VCOM = 0.3V, 3V, or VNO or VNC = 0.3V, 3V, 25
or Floating
Full
-100
-195
100
nA
195
nA
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
V+ = 3.9V, VNO or VNC = 3.0V, RL = 50Ω, CL = 35pF,
25
(See Figure 1, Note 9)
Full
20
30
ns
35
ns
Turn-OFF Time, tOFF
V+ = 3.9V, VNO or VNC = 3.0V, RL = 50Ω, CL = 35pF,
25
(See Figure 1, Note 9)
Full
15
25
ns
30
ns
Break-Before-Make Time Delay, tD V+ = 4.5V, VNO or VNC = 3.0V, RL = 50Ω, CL = 35pF, Full
2
4
ns
(See Figure 3, Note 9)
Charge Injection, Q
OFF Isolation
CL = 1.0nF, VG = 0V, RG = 0Ω, (See Figure 2)
25
RL = 50Ω, CL = 5pF, f = 100kHz, VCOM = 1VRMS,
25
(See Figure 4)
128
pC
68
dB
Crosstalk (Channel-to-Channel)
RL = 50Ω, CL = 5pF, f = 100kHz, VCOM = 1VRMS,
25
(See Figure 6)
-95
dB
3
FN6128.2
September 13, 2006