ISL29027 Datasheet, PDF (3/13 Pages) Intersil Corporation – Proximity Sensor with Intelligent Interrupt and Sleep Modes

ISL29027
Absolute Maximum Ratings (T_A = +25°C)
V_DD Supply Voltage between V_DD and GND . . . . . . . . . . . . . . . . . . . . . .4.0V
I²C Bus Pin Voltage (SCL, SDA). . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 4.0V
I²C Bus Pin Current (SCL, SDA). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <10mA
R_EXT Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD + 0.5V
IRDR Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5.5V
ADDR0 Pin Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD + 0.5V
INT Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 4.0V
INT Pin Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <10mA
ESD Rating
Human Body Model (Note 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV
Thermal Information
Thermal Resistance (Typical)
θ_JA (°C/W) θ_JC (°C/W)
8 Ld ODFN Package (Notes 4, 5) . . . . . . . .
88
10
Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +90°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +100°C
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. θ_JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
5. For θ_JC, the “case temp” location is the center of the exposed metal pad on the package underside.
6. ESD on all pins is 2kV except for IRDR, which is 1.5kV.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise
noted, all tests are at the specified temperature and are pulsed tests, therefore: T_J = T_C = T_A
Electrical Specifications V_DD = 3.0V, T_A = +25°C, R_EXT = 499kΩ 1% tolerance.
PARAMETER
DESCRIPTION
V_DD
Power Supply Range
SR_V_DD Input Power-up Slew Rate
I_{DD_OFF} Supply Current when Powered Down
I_{DD_PRX_SLP} Supply Current for Prox in Sleep Time
f_OSC
Internal Oscillator Frequency
t_{INTGR_PROX} 8-bit Prox Integration/Conversion Time
DATA_{PROX_0} Prox Measurement w/o Object in Path
DATA_{PROX_F} Full Scale Prox ADC Code
DATA_{PROX_1} Prox Measurement Result
t_r
Rise Time for IRDR Sink Current
t_f
Fall time for IRDR Sink Current
I_{IRDR_0} IRDR Sink Current
I_{IRDR_1} IRDR Sink Current
I_{IRDR_LEAK} IRDR Leakage Current
V_IRDR
Acceptable Voltage Range on IRDR Pin
t_PULSE Net I_IRDR On Time Per PROX Reading
V_REF
F_I2C
V_I2C
Voltage of R_EXT Pin
I²C Clock Rate Range
Supply Voltage Range for I²C Interface
V_IL
SCL and SDA Input Low Voltage
V_IH
SCL and SDA Input High Voltage
I_SDA
SDA Current Sinking Capability
I_INT
INT Current Sinking Capability
CONDITION
V_DD Rising Edge between 0.4V and 2.25V
PROX_EN = 0
PROX_EN = 1
(Note 7)
R_LOAD = 15Ω at IRDR pin, 20% to 80%
R_LOAD = 15Ω at IRDR pin, 80% to 20%
PROX_DR = 0; V_IRDR = 0.5V
PROX_DR = 1; V_IRDR = 0.5V
PROX_EN = 0; V_DD = 3.63V (Note 8)
Register bit PROX_DR = 0
V_OL = 0.4V
V_OL = 0.4V
MIN
MAX
(Note 9) TYP (Note 9) UNIT
2.25 3.0 3.63 V
0.5
V/ms
0.1 0.8 µA
80
µA
5.25
MHz
0.54
ms
1
2 Counts
255 Counts
36 46 56 Counts
500
ns
500
ns
95 110 125 mA
220
mA
0.001 1
µA
0.5
4.3 V
100
µs
0.51
V
400 kHz
1.7
3.63 V
0.55 V
1.25
V
3
5
mA
3
5
mA
3
FN7815.0
February 7, 2011