HCS74T Datasheet, PDF (3/3 Pages) Intersil Corporation – Radiation Hardened Dual-D Flip-Flop with Set and Reset

HCS74T
Die Characteristics
DIE DIMENSIONS:
(2261µm x 2235µm x 533µm ±51µm)
89 x 88 x 21mils ±2mil
METALLIZATION:
Type: Al Si
Thickness: 11kÅ ±1kÅ
SUBSTRATE POTENTIAL:
Unbiased (Silicon on Sapphire)
BACKSIDE FINISH:
Sapphire
Metallization Mask Layout
D1
(2)
PASSIVATION:
Type: Silox (S_iO₂)
Thickness: 13kÅ ±2.6kÅ
WORST CASE CURRENT DENSITY:
< 2.0e5 A/cm²
TRANSISTOR COUNT:
192
PROCESS:
CMOS SOS
HCS74T
R1
V_CC
(1)
(14)
CP1 (3)
(13) R2
NC
S1 (4)
Q1 (5)
(12) D2
NC
(11) CP2
Q1 (6)
(7)
(8)
(9)
GND
Q2
Q2
(10) S2
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