ISL33354E Datasheet, PDF (23/23 Pages) Intersil Corporation – Full fail-safe (open/short) RS-485/422 port 2 Rx

ISL33354E, ISL33357E
Shrink Small Outline Plastic Packages (SSOP)
N
INDEX
AREA
H
E
-B-
0.25(0.010) M B M
GAUGE
PLANE
123
-A- _D
SEATING PLANE
A
L
0.25
0.010
-C-

e
A1
A2
C
B
0.10(0.004)
0.25(0.010) M C A M B S
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess of
“B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M28.209 (JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
-
A2
0.065 0.072
1.65
1.85
-
B
0.009 0.014
0.22
0.38
9
C
0.004 0.009
0.09
0.25
-
D
0.390 0.413
9.90 10.50
3
E
0.197 0.220
5.00
5.60
4
e
0.026 BSC
0.65 BSC
-
H
0.292 0.322
7.40
8.20
-
L
0.022 0.037
0.55
0.95
6
N
28
28
7

0°
8°
0°
8°
-
Rev. 2 6/05
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For the most recent package outline drawing, see M28.209.
FN8775.1
October 21, 2016